Kembond SNG-RTV |
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| Kembond SNG-RTV is a single component electrically conductive adhesive comprising of silicone resin filled with conductive nickel coated graphite particles. It cures on exposure to air at room temperature to form an electrically conductive flexible silicone elastomer. Once cured it adheres strongly to a wide range substrates. Can generally be used a replacement for BS100. |
Main features
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Applications
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Uncured Properties | |
| Colour | Dark Grey/Brown |
| Form | Semi flowable paste |
| Cure time - 10mm bond width at 23 °C/50% RH | 24 hours |
| Recommended minimum time before stressing bond | 48 hours |
Cured Properties | |
| Density | 2.1 g/cm³ |
| Hardness | 75 Shore A |
| Elongation | 75% |
| Adhesion - lap shear (aluminium to aluminium) | 150 N/cm² |
| Service temperature range | -50°C to 150°C |
| Bond resistance (aluminium to aluminium) | <10mΩ/cm² |
| Thermal conductivity | 1.0 Wm/K |
| Recommended bond thickness | 0.05 - 0.5mm |
PackagingKembond SNG-RTV can be supplied in either standard manual or pneumatic (air dispense) 10ml syringe barrels from which the material may be directly applied. Both formats will accept a variety of dispense tips (including luer lock types) for accurate, controlled application. Larger sizes of 55ml & 170ml are available on request |
StorageIt is recommended that when not in use that the material is stored in a cool dark, dry place. If the facility exists then some form of refrigerated or freezer storage is ideal. If kept properly sealed and in a suitable location then the material will remain usable for up to 16 weeks. |
HandlingWhen using this material observe usual standards of industrial hygiene/practice. Avoid skin/eye contact and work in a well ventilated area. For more detailed information please refer to the MSDS (Material Safety Data Sheet) |
Instructions for useSurfaces should be clean dry and sound i.e. free from loose material. It is recommended that areas to be bonded are cleaned using a suitable solvent prior to applying the sealant To ensure the highest level of electrical or shielding performance it is essential that the surfaces to be bonded have a low contact resistance. This means that materials that have a naturally occurring oxide layer such as aluminium alloys may need to be lightly abraded and cleaned directly prior to bonding. Assemble parts as soon as possible and certainly within 5 minutes of sealant application Material cures from it's outer exposed surface inwards, therefore avoid bond widths greater than 12mm In most cases parts may be handled after 24 hours but avoid stressing the joint until full cure has been achieved The time for full cure to take place is dependent on both humidity and temperature. Higher levels of temperature and humidity will minimise curing times whilst low levels of humidity and temperature will retard curing. Generally, cure rate may be most conveniently controlled by means of temperature Excess material should be removed by means of a spatula or similar implement. Smaller traces of the uncured material may be removed by wiping with a lint free cloth damped with MEK, petroleum spirit etc taking care to observe the safety precautions required in using flammable/harmful solvents of this type A priming agent is available for treating some inconsistent or difficult to bond surfaces. Please contact us for further information |
Product NotesTo the best our knowledge the information contained in this data sheet is accurate and representative of the product, however, it is the responsibility of the user to determine the suitability, safety and legality of use in any application We recommend that the end user performs an evaluation to determine the suitability of the product in their application |
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